SiSiC plates for semiconductor machinery

Published:  17 September, 2020

With photolithography systems for semiconductor manufacturing becoming ever more sophisticated, component suppliers need to be able to provide products of the highest quality to meet the current and future demands in chip production. Based on ongoing in-house research and development, CERAMTEC says its “Rocar SiF” plates made of high-performance SiSiC as a lightweight silicon carbide ceramic achieve an optimal balance of material properties which contribute to higher chip quality.

The company, a leader in the production of advanced technical ceramics, provides SiSiC (silicon infiltrated silicon carbide) plates made of silicon carbide with a specific amount of metal silicon, which form the basis for electrostatic chucks. These wafer chucks are used in semiconductor machinery for the production of chips to accurately position the silicon wafer in the machine.

w: www.ceramtec.com/ceramic-materials/silicon-carbide/

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